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data sheet broadcom av02-0198en february 16, 2018 description this family of smt leds is packaged in the industry standard plcc-2 package. these smt leds have high reliability performa nce and are designe d to work under a wide range of environmental cond itions. this high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. to facilitate easy pick and pla ce assembly, t he leds are packed in eia-compliant tape and reel. every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. these leds are compatible wit h ir solder reflow process. due to the high reliability featur e of these products, they can also be mounted using through-the-wave soldering process. the super wide viewing angle at 120 makes these leds ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. the flat top emitting surface makes it easy for th ese leds to mate with light pipes. with the built-in reflecto r pushing up the intensity of the light output, these leds are also suitable to be used as led pixels in interior electronic signs. features ? industry standard plcc-2 package ? high reliability led package ? high brightness using alingap and ingan dice technologies ? available in full selection of colors ? super wide viewing angle at 120 ? available in 8 mm carrier tape on 7 inch reel (2000 pieces) ? compatible with bo th ir and ttw soldering process applications ? interior automotive C instrument panel backlighting C central console backlighting C switch/push button backlighting ? electronic signs and signals C interior full color sign C variable message sign ? office automation, home appliances, industrial equipment C front panel backlighting C push button backlighting C display backlighting caution! hsmn, m, and e-a10x-xxxxx leds are class 2 esd sensitive. pleas e observe appropriate precautions during handling and processing. refer to broadcom application note an- 1142 for addit ional details. hsmx-a10x-xxxxx plcc-2, surface mount led indicator
broadcom av02-0198en 2 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator package dimensions 0.8 0.3 3.5 0.2 2.8 0.2 0.5 0.1 3.2 0.2 2.2 0.2 1.9 0.2 0.1 typ. 0.8 0.1 cathode marking (anode marking for algaas devices) 5.2 0.2 2.8 0.2 0.5 0.1 0.1 typ. 3.2 0.2 2.2 0.2 1.9 0.2 cathode marking note: all dimensions in millimeters. top mount reverse mount
broadcom av02-0198en 3 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator device selection guide red red orange orange part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsms-a100-j00j1 4.50 15.00 20 gap hsms-a100-l00j1 11.20 15.00 20 gap hsms-a100-j80j2 5.60 14.00 10 gap hsmh-a100-l00j1 11.20 15.00 20 algaas hsmh-a100-n00j1 28.50 50.00 20 algaas hsmc-a100-q00j1 71.50 100.00 20 alingap hsmc-a100-r00j1 112.50 140.00 20 alingap hsmc-a101-s00j1 180.00 220.00 20 alingap hsmz-a100-t00j1 285.00 350.00 20 alingap hsmc-a100-n00h1 28.50 20 alingap hsmc-a100-q70j1 90.00 180.0 20 alingap hsmc-a101-s30j1 180.00 355.0 20 alingap hsmc-a101-s40j1 180.00 450.0 20 alingap hsmz-a100-r00j1 112.50 20 alingap hsmz-a100-t70j1 355.00 715.0 20 alingap part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmj-a100-q00j1 71.50 100.00 20 alingap hsmj-a101-s00j1 180.00 200.00 20 alingap hsmj-a100-t40j1 285.00 715.00 20 alingap hsmv-a100-t00j1 285.00 350.00 20 alingap hsmj-a100-r40j1 112.50 285.00 20 alingap part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmd-a100-j00j1 4.50 15.00 20 gap hsmd-a100-l00j1 11.20 15.00 20 gap hsmd-a100-k4pj2 7.20 18.00 10 gap hsml-a100-q00j1 71.50 100.00 20 alingap hsml-a101-s00j1 180.00 220.00 20 alingap
broadcom av02-0198en 4 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator yellow/amber yellow green emerald green green part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmy-a100-j00j1 4.50 12.00 20 gap hsmy-a100-l00j1 11.20 12.00 20 gap hsma-a100-q00j1 71.50 100.00 20 alingap hsma-a101-s00j1 180.00 220.00 20 alingap hsmu-a100-s00j1 180.00 320.00 20 alingap hsma-a101-r8wj1 140.00 355.00 20 alingap hsma-a100-q00h1 71.50 20 alingap hsma-a100-r40j1 112.50 285.00 20 alingap hsma-a100-r45j1 12.50 285.00 20 alingap hsma-a101-s3wj1 180.00 355.00 20 alingap part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmg-a100-j02j1 4.50 18.00 20 gap HSMG-A100-K72J2 9.00 18.00 10 gap hsme-a100-m02j1 18.00 70.00 20 alingap hsme-a100-n82j1 35.50 90.00 20 alingap part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmg-a100-h01j1 2.80 8.00 20 gap hsme-a100-l01j1 11.20 40.00 20 alingap hsme-a100-m3pj1 18.00 35.50 20 alingap hsmg-a100-k42j2 7.20 18 20 gap hsmg-a100-l02j1 11.20 20 gap part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmm-a101-r00j1 112.50 200.00 20 ingan hsmm-a100-s00j1 180.00 350.00 20 ingan hsmm-a100-u4pj1 450.00 1125.00 20 ingan hsmm-a101-r00h1 112.50 20 ingan
broadcom av02-0198en 5 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator blue part numbering system absolute maximum ratings (t a = 25c) part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmn-a101-n00j1 28.50 50.00 20 ingan hsmn-a100-p00j1 45.00 70.00 20 ingan hsmn-a100-s4yj1 180.00 450.00 20 ingan hsmn-a100-r8yj1 140.00 355.00 20 ingan hsmn-a100-r00j1 112.50 20 ingan parameters hsms/d/y/g hsmh hsmc/j/l/a hsme hsmz/v/u hsmm/n dc forward current a a. derate linearly as shown in figure 4 . 30 ma 30 ma 30 ma b, c b. drive current between 10 ma and 30 ma is recommended for best long term performance. c. operation at current below 5 ma is not recommended. 20 ma c 30 ma b, c 30 ma peak forward current d d. duty factor = 10%, frequency = 1 khz. 100 ma 100 ma 100 ma 100 ma 100 ma 100 ma power dissipation 63 mw 60 mw 63 mw 48 mw 63 mw 114 ma reverse voltage 5v junction temperature 110c operating temperat ure C55c to +100c storage temperatur e C55c to +100c packaging option color bin selection intensity bin select package type device specific configuration led chip color hsm x 1 - a x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9
broadcom av02-0198en 6 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator optical characteristics (t a = 25c) electrical characteristics (t a = 25c) color part number dice technology peak wavelength peak (nm) typ. dominant wavelength a d (nm) typ. a. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents t he color of the device. viewing angle 2 1/2 b (degrees) typ. b. 1/2 is the off -axis angle where t he luminous intensity is 1/2 the peak intensity. luminous efficacy v c (l m /w) typ. c. radiant intensity, ie in watts /steradian, may be calculated f rom the equation ie = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. luminous intensity/total flux i v (mcd)/ v (mlm) typ. red hsms-a100 gap 635 626 120 120 0.45 hsmh-a100 algaas 645 637 120 63 0.45 hsmc-a10x alingap 635 626 120 150 0.45 hsmz-a100 alingap 635 626 120 155 0.45 red hsmj-a10x alingap 621 615 120 240 0.45 orange hsmv-a100 alingap 623 617 120 263 0.45 orange hsmd-a100 gap 600 602 120 380 0.45 hsml-a10x alingap 609 605 120 320 0.45 amber hsmy-a100 gap 583 585 120 520 0.45 hsma-a10x alingap 592 590 120 480 0.45 hsmu-a100 alingap 594 592 120 500 0.45 yellow green hsmg-a100 gap 565 569 120 590 0.45 hsme-a100 alingap 575 570 120 560 0.45 emerald green hsmg-a100 gap 558 560 120 650 0.45 hsme-a100 alingap 566 560 120 610 0.45 green hsmm-a10x ingan 523 525 120 500 0.45 blue hsmn-a10x ingan 468 470 120 75 0.45 part number forward voltage v f (volts) at i f = 20 ma reverse voltage v r at 100 a min. reverse voltage v r at 10 a min. thermal resistance r jp (cw) typ. max. hsms/d/y/g 2.2 2.6 5 180 hsmh 1.9 2.6 5 180 hsmc/j/l/a/e 1.9 2.4 5 280 hsmz/v/u 1.9 2.4 5 280 hsmm/n 3.4 4.05 5 280
broadcom av02-0198en 7 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator figure 1: relative intensity vs. wavelength wavelength C nm emerald green relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 blue 0.6 0.4 0.2 green yellow green amber orange red orange red 0.1 0.3 0.5 0.7 0.9 wavelength C nm relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 gap emerald green gap orange gap red 0.6 0.4 0.2 gap yellow gap yellow green
broadcom av02-0198en 8 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator figure 2: forward current vs. f orward voltage figure 3: relati ve intensity vs. forward current 3 0 forward voltage C v 0 10 30 35 forward current C ma 5 5 20 15 25 12 4 hsmc/j/l/a/e/z/v/u hsmm/n hsmh hsms/d/y/g 0 2 0 dc forward current C ma 0 0.4 1.8 relative luminous intensity (normalized at 20 ma) 35 0.8 0.2 1.0 10 0.6 1.2 25 alingap gap 515 30 1.4 1.6 algaas ingan figure 4: maximum forward c urrent vs. ambient temper- ature, derated based on t j max = 110c, r ja = 500 c/w figure 5: maximum forward current vs. solder point temperature, derated based on t j max = 110c, r ja = 180 c/w or 280 c/w 0 5 10 15 20 25 30 35 0 20 40 60 80 100 120 temperature (c) current - ma hsms/d/g/ y/h/z/v/u hsme hsmm/n hsmc/j/l/a 0 5 10 15 20 25 30 35 020406080100 120 temperature (c) current - ma hsms/d/g/y/h hsmc/j/l/a hsmz/v/u hsmm/n hsme )ljxuhrpldw:dyhohjwkyv)ruzdugxuuhwd1 hylfhv )ljxuh)ruzdug9rowd jh6kliwyv7hpshudwxuh 0 2 0 current C ma 460 480 540 dominant wavelength C nm 35 500 470 510 10 490 520 25 green 515 30 530 blue delta v f (normalized at 25c) -0.3 -100 temperature C c 0.5 0.4 0.2 0.1 0 -0.2 150 50 -50 0 100 -0.1 0.3 gap/algaas/ alingap ingan/gan
broadcom av02-0198en 9 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator figure 8: radiation pattern note: for detailed information on reflow soldering of broadcom surfac e mount leds, refer to broadcom application note an 1060, surface mounting smt led indicator components . reflow soldering must not be done more than twice. observe nece ssary precautions of handling moisture sensitive device as stated in the following section. figure 9: recommended soldering pad pattern normalized intensity 1.0 0 angular displacement C degrees 0.8 0.6 0.2 0.4 -70 -50 -30 0 20 30 50 70 90 0 2 - 0 9 - -80 -60 -40 -10 10 40 60 80 2.60 4.50 1.50 solder resist
broadcom av02-0198en 10 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator figure 10: tape leader and trailer dimensions figure 11: tape dimensions 200 mm min. for ?180 reel. 200 mm min. for ?330 reel. r e d a e l t n e n o p m o c r e l i a r t 480 mm min. for ?180 reel. 960 mm min. for ?330 reel. c a user feed direction c a 4 0.1 4 0.1 2 0.05 3.05 0.1 3.5 0.05 8 +0.3 C0.1 1.75 0.1 3.81 0.1 2.29 0.1 0.229 0.01 8 ? 1.5 +0.1 C0 ?1 +0.1 C0
broadcom av02-0198en 11 hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator figure 12: reel dimensions figure 13: reeling orientation 14.4 (max. measured at hub) 7.9 (min.) 10.9 (max.) 62.5 2 +0.5 C0 ? 20.5 0.3 ? 13 0.2 +0 C2.5 8.4 (measured at outer edge) +1.50 C0.00 180 label area (111 mm x 57 mm) with depression (0.25 mm) cathode side printed label user feed direction
hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator broadcom av02-0198en 12 intensity bin select (x 5 x 6 ) individual reel will contain pa rts from one ha lf bin only. intensity bin limits tolerance of each bin limit = 12% x 5 min. i v bin x 6 0 full distribution 2 2 half bins starting from x 5 1 3 3 half bins starting from x 5 1 4 4 half bins starting from x 5 1 5 5 half bins starting from x 5 1 6 2 half bins starting from x 5 2 7 3 half bins starting from x 5 2 8 4 half bins starting from x 5 2 9 5 half bins starting from x 5 2 bin id min. (mcd) max. (mcd) g1 1.80 2.24 g2 2.24 2.80 h1 2.80 3.55 h2 3.55 4.50 j1 4.50 5.60 j2 5.60 7.20 k1 7.20 9.00 k2 9.00 11.20 l1 11.20 14.00 l2 14.00 18.00 m1 18.00 22.40 m2 22.40 28.50 n1 28.50 35.50 n2 35.50 45.00 p1 45.00 56.00 p2 56.00 71.50 q1 71.50 90.00 q2 90.00 112.50 r1 112.50 140.00 r2 140.00 180.00 s1 180.00 224.00 s2 224.00 285.00 t1 285.00 355.00 t2 355.00 450.00 u1 450.00 560.00 u2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00
hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator broadcom av02-0198en 13 color bin select (x 7 ) individual reel will contain pa rts from one full bin only. color bin limits x 7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b, and c only p b, c, and d only n c, d, and e only m d, e, and f only l e, f, and g only k f, g, and h only 1 a, b, c, and d only 2 e, f, g, and h only 3 b, c, d, and e only 4 c, d, e, and f only 5 a, b, c, d, and e only 6 b, c, d, e, and f only color min. (nm) max. (nm) blue a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 green a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 emerald green a 552.5 555.5 b 555.5 558.5 c 558.5 561.5 d 561.5 564.5 yellow green e 564.5 567.5 f 567.5 570.5 g 570.5 573.5 h 573.5 576.5 amber a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 orange a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 red orange a 611.0 616.0 b 616.0 620.0 red full distribution
hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator broadcom av02-0198en 14 packaging option (x 8 x 9 ) precautionary notes soldering ? do not perform reflow sol dering more than twice. observe necessary p recautions of h andling moisture- sensitive device as stated in the following section. ? do not apply any pressure or force on the led during reflow and after reflow wh en the led is still hot. ? use reflow soldering to s older the led. use hand soldering only for rework if unavoidable, but it must be strictly controlled to f ollowing conditions: C soldering iron tip te mperature = 315c max. C soldering duration = 3s max. C number of cycles = 1 only C power of soldering iron = 50w max. ? do not touch the led package body with the soldering iron except for the soldering terminals, as it may cause damage to the led. ? confirm beforehand whethe r the functionality and performance of the led is affected by soldering with hand soldering. figure 14: recommended pb-f ree reflow soldering profile figure 15: recommended board reflow direction handling precautions for automated pick and place, broadcom has tested a nozzle size with od 1.5 mm to work with this led. however, due to the possibility of variati ons in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the led. option test current package type reel size j1 20 ma top mount 7 inches j4 20 ma top mount 13 inches h1 20 ma reverse mount 7 inches h4 20 ma reverse mount 13 inches j2 10 ma top mount 7 inches j5 10 ma top mount 13 inches h2 10 ma reverse mount 7 inches h5 10 ma reverse mount 13 inches l2 2 ma top mount 7 inches 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. (acc. to j-std-020c) 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. 10 to 30 sec. time temperature
hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator broadcom av02-0198en 15 handling of moisture-sensitive devices this product has a moisture s ensitive level 2a rating per jedec j-std-020. refer to broadcom application note an5305, handling of moistur e sensitive surface mount devices for additional details and a review of proper handling procedures. ? before use: C an unopened moisture barrier bag (mbb) can be stored at <40c/90% rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe t o reflow the leds per the original msl rating. C do not open the mbb pr ior to assembly (for example, for iqc). if u navoidable, mbb must be properly resealed with fresh desiccant and hic. the exposed duration must be taken in as floor life. ? control after opening the mbb: C read the hic immediat ely upon opening of mbb. C keep the leds at <30/60% rh at all times, and complete all high temperature-related processes, including soldering, curing or rework within 672 hours. ? control for unfinished reel: store unused leds in a sealed mbb with desiccant or a desiccator at <5% rh. ? control of assembled boards: if the pcb soldered with the l eds is to be subjected to other high-temperature proc esses, store the pcb in a sealed mbb with desiccant or desiccator at <5% rh to ensure that all leds have not exceeded their floor life of 168 hours. ? baking is required if: C the hic indicator indicates a change in color for 10% and 5%, as stated on the hic. C the leds are exposed to conditions of >30c/60% rh at any time. C the led's floor life exceeded 168 hours. the recommended baking cond ition is: 605c for 20 hours. baking can only be done once. ? storage: the soldering terminals o f these broadcom leds are silver plated. if the leds are exposed in ambient environment for too long, th e silver plating might be oxidized, thus affecting its solderability performance. as such, keep unused leds in a sealed mbb with desiccant or in a desiccator at <5% rh. application precautions ? the drive current of the led must not exceed the maximum allowable limit across temperature as stated in the data sheet . constant current driving is recommended to ensure consistent performance. ? circuit design must cater to the whole range of forward voltage (v f ) of the leds to ensur e the intended drive current can always be achieved. ? the led exhibits slightly dif ferent characteristics at different drive currents, whi ch may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). set the application current as close as possib le to the test current to minimize these variations. ? the led is not intended fo r reverse bias. use other appropriate components for such purposes. when driving the led in matrix fo rm, ensure that the reverse bias voltage does not exceed the allowable limit of the led. ? do not use the led in the vicinity of material with sulfur content or in environments of high gaseous sulfur compounds and corrosive elements. examples of material that might contain s ulfur are rubber gaskets, room- temperature vulcanizing (rtv) silicone rubber, rubber gloves, and so on. prolonged exposure to such environments may affect the optical characteristics and product life. ? white leds must not be exposed to acidic environments and must not be used in the vicinity of any compound that may have acidic outgas, such as, but not limited to, acr ylate adhesive. these environments have an adverse effect on led performance. ? this led is designed to hav e enhanced gas corrosion resistance. its per formance has been tested according to the conditions below: C iec 60068-2-43: 25c/75% rh, h2s 15 ppm, 21 days C iec 60068-2-42: 25c/ 75% rh, so2 25 ppm, 21 days C iec 60068-2-60: 25c/75 % rh, so2 200 ppb, no2 200 ppb, h2s 10 ppb, cl2 10 ppb, 21 days. ? as actual application might not be exactly similar to the test conditions, do verify that the led will not be damaged by prolonged exposure in the intended environment. ? avoid rapid change in ambie nt temperature, especially in high-humidity environments, because they cause condensation on the led.
hsmx-a10x-xxxxx data sheet plcc-2, surface mount led indicator broadcom av02-0198en 16 ? if the led is intended to be used in harsh or outdoor environment, protect the led against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. thermal management the optical, electrical, and re liability characteristics of the led are affected by temperature. keep the junction temperature (t j ) of the led below the allowable limit at all times. t j can be calculated as follows: t j = t a + r j-a x i f x v fmax where; t a = ambient temperature (c) r j-a = thermal resistance from led junction to ambient (c/w) i f = forward current (a) v fmax = maximum forward voltage (v) the complication of using this formula lies in t a and r j-a . actual t a is sometimes subjective and hard to determine. r j-a varies from system to syst em depending on design and is usually not known. another way of calculating t j is by using the solder point temperature, ts as follows: t j = t s + r j-s x i f x v fmax where; t s = led solder point temp erature as shown in the following figure (c) r j-s = thermal resistance from j unction to solder point (c/w) i f = forward current (a) v fmax = maximum forward voltage (v) figure 16: solder point temperatures on pcb t s can be easily measured by mounting a thermocouple on the soldering joint as shown in preceding figure, while r j-s is provided in the data sheet. verify the t s of the led in the final product to ensure that the leds are operating within all maximum ratings state d in the data sheet. eye safety precautions leds may pose optical hazard s when in opera tion. do not look directly at operating led s because it might be harmful to the eyes. for safety reasons, use appropriate shielding or personal protective equipment. ts point package mark
broadcom, the pulse logo, connect ing everything, avago technolo gies, avago, and the a logo are among the trademarks of broadcom and/or it s affiliates in the un ited states, certain other countries, and/or the eu. copyright ? 2017C2018 broadcom. all rights reserved. the term broadcom refers to broadcom limited and/or its subsi diaries. for more information, please visit www.broadcom.com . broadcom reserves the right to ma ke changes without further not ice to any products or data he rein to improve reliability, function, or design. information furnished by broadcom is belie ved to be accurate and reliable. however, broadcom does not assume any liability arising out of the application or use of this information, nor the app lication or use of any product or circuit described herein, neither does it convey any license un der its patent rights nor the rights of others. disclaimer broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, c onstruction, maintenance, or d irect operation of a nuclear fa cility or for use in medical devices or applications. the cust omer is solely responsible, an d waives all rights to make clai ms against broadcom or its suppliers, for all lo ss, damage, expense, o r liability in conne ction with such use.

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